| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
| AFGA |
OPERATING TEMP RANGE |
+0.0/+70.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.180 INCHES NOMINAL |
| ABHP |
OVERALL LENGTH |
0.770 INCHES MAXIMUM |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
POSITIVE NAND BUFFER |
| CZEQ |
TIME RATING PER CHACTERISTIC |
15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 29.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| ADAT |
BODY WIDTH |
0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-55.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ABKW |
OVERALL HEIGHT |
0.325 INCHES NOMINAL |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND BURN IN |
| ADAQ |
BODY LENGTH |
0.770 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 BUFFER, NAND |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |