| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
03848-4-08766 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 DRIVER, MEMORY CORE |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
METAL |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
700.0 MILLIWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 FLAT LEADS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |