5962-01-062-0029 ( LM108AW/883C , LH3042 , JM38510/10104BHA , SL73638 , A574A391-101 , JL108ABHA , LM108AF , LM108AF )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-01-062-0029 | 5962 | 010620029 | MICROCIRCUIT,LINEAR | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.270 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 88818-A574A391 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND EXTERNALLY COMPENSATED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| LM108AW/883C | 27014 | A | 1 | 5 | 6 | TX | |
| LH3042 | 34335 | A | 2 | 5 | 5 | TX | |
| JM38510/10104BHA | 27014 | A | 9 | 5 | 6 | TX | |
| SL73638 | 27014 | A | 2 | 5 | 5 | TX | |
| A574A391-101 | 88818 | A | 2 | 3 | 1 | TX | |
| JL108ABHA | 27014 | A | 1 | 5 | 6 | TX | |
| LM108AF | 34335 | A | 1 | 5 | 3 | TX | |
| LM108AF | 27014 | A | 1 | 5 | 3 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| LM108AW/883C | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| LH3042 | 34335 | ADVANCED MICRO DEVICES, INC. | A | A |
| JM38510/10104BHA | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| SL73638 | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| A574A391-101 | 88818 | KEARFOTT CORPORATION | F | A |
| JL108ABHA | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| LM108AF | 34335 | ADVANCED MICRO DEVICES, INC. | A | A |
| LM108AF | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | X | Q | 07/07/1 | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 35325 | J | 72D | 3 | 9 | A | H | Z | ELEC APPLIANCES/INSTRUMENTS NOI |