| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
RESETTABLE AND W/DECODED OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND W/ENABLE AND W/BUFFERED OUTPUT |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.780 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
18.5 VOLTS MAXIMUM POWER SOURCE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 800.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AGAV |
END ITEM IDENTIFICATION |
6130-00-168-8483 |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COUNTER |
| CQZP |
INPUT CIRCUIT PATTERN |
3 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU |
BODY HEIGHT |
0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |