5962-01-077-6118 ( AM3705DM , DG501AP/883B-2 , DG501AP/883C , DG501AP-2 , DG501BP , 351-7449-021 , 730-0045 , DMS 91137B , DG501AP-4 , 900348 , 0213-1-1150-2 , 310429P2 , DG501AP/883B , AM3705D883B )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-077-6118 5962 010776118 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CBBL FEATURES PROVIDED POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND MONOLITHIC AND W/ENABLE
AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS MAXIMUM POWER SOURCE
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS
ADAQ BODY LENGTH 0.840 INCHES MAXIMUM
CQZP INPUT CIRCUIT PATTERN 8 INPUT
ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CZEQ TIME RATING PER CHACTERISTIC 1500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 2500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510
CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CZER MEMORY DEVICE TYPE ROM
TEST TEST DATA DOCUMENT 15942-0213-1-1150-2 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
AM3705DM 27014 A 8 E 4 TX
DG501AP/883B-2 17856 A 9 5 6 TX
DG501AP/883C 17856 A 9 5 6 TX
DG501AP-2 17856 A 1 C A5 5 TX
DG501BP 17856 A 1 C AC 6 ZZ
351-7449-021 13499 A 1 C AC 6 ZZ
730-0045 22818 A 1 C AF 6 TX
DMS 91137B 16236 A 9 5 9 TX
DG501AP-4 17856 A 9 5 3 TX
900348 33827 A 2 5 1 TX
0213-1-1150-2 15942 F 2 3 1 TX
310429P2 94117 A 8 E A TX
DG501AP/883B 17856 A 9 5 6 ZZ
AM3705D883B 27014 A 8 E 4 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
AM3705DM 27014 NATIONAL SEMICONDUCTOR CORPORATI A A
DG501AP/883B-2 17856 SILICONIX INCORPORATED A A
DG501AP/883C 17856 SILICONIX INCORPORATED A A
DG501AP-2 17856 SILICONIX INCORPORATED A A
DG501BP 17856 SILICONIX INCORPORATED A A
351-7449-021 13499 ROCKWELL COLLINS INC. F A
730-0045 22818 HUBBELL HARVEY INC A A
DMS 91137B 16236 DLA LAND AND MARITIME A A
DG501AP-4 17856 SILICONIX INCORPORATED A A
900348 33827 BAE SYSTEMS INTEGRATED DEFENSE A A
0213-1-1150-2 15942 USACECOM INTELLIGENCE ELECTRONIC A F
310429P2 94117 BAE SYSTEMS INFORMATION AND A A
DG501AP/883B 17856 SILICONIX INCORPORATED A A
AM3705D883B 27014 NATIONAL SEMICONDUCTOR CORPORATI A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
U 0 X D 1 05/26/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DF N SF9EH-N F DOD I&S FAMILY MASTER NSN
DS N I DOD I&S FAMILY MASTER NSN
DS N I 7 USE UNTIL EXHAUSTED 5962-01-109-8732
DN 9B----- N 7 USE UNTIL EXHAUSTED 5962-01-109-8732
DA Z Q2200X- A
DN 9B----- N DOD I&S FAMILY MASTER NSN
DF N SF9EH-N F 7 USE UNTIL EXHAUSTED 5962-01-037-7677
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
D U N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DA SMS Z 1 EA 0 7 Z Q2200X- A
DS SMS Z 1 EA 0 7 D
DN SMS Z 1 EA 0 7 9B----- N
DF SMS Z 1 EA 0 7 SF9EH-N F
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Q 2 2 00 X
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 35325 J 72D 3 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI