| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
175.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.0 VOLTS MAXIMUM POWER SOURCE |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 INVERTER, DIGITAL |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL |
FEATURES PROVIDED |
3-STATE OUTPUT AND MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |