5962-01-090-9754 ( SC5231018-02 , NE592K , SE592K , SE592H )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-090-9754 5962 010909754 MICROCIRCUIT,LINEAR 3177
NSN Features
MRC Parameter Characteristics
PMLC PRECIOUS MATERIAL AND LOCATION TERMINAL SURFACE GOLD
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
PRMT PRECIOUS MATERIAL GOLD
CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, DIFFERENTIAL AND 1 AMPLIFIER, VIDEO
CQZP INPUT CIRCUIT PATTERN 2 INPUT
CQSJ INCLOSURE MATERIAL GLASS AND METAL
AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS
CWSG TERMINAL SURFACE TREATMENT GOLD
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND INTERNALLY COMPENSATED AND ADJUSTABLE
ADAR BODY OUTSIDE DIAMETER 0.355 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
CQSZ INCLOSURE CONFIGURATION CAN
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
SC5231018-02 96682 A 2 3 1 TX
NE592K 18324 A 1 C 6 TX
SE592K 18324 A 2 3 3 TX
SE592H 18324 A 2 5 3 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
SC5231018-02 96682 GENISCO TECHNOLOGY CORPORATION A A
NE592K 18324 PHILIPS SEMICONDUCTORS INC A A
SE592K 18324 PHILIPS SEMICONDUCTORS INC A A
SE592H 18324 PHILIPS SEMICONDUCTORS INC A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
G 0 X Q 3 02/28/1 B N 8542900000 3177
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DN 9B----- N Z DISCONTINUED-USE 5962-00-256-0340
DS I Z DISCONTINUED-USE 5962-00-256-0340
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q G N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DS SMS Y 1 EA 0 U D
DN SMS Y 1 EA 0 U 9B----- N
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 35325 J 72D 3 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI