| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.373 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
7 INPUT |
| CZER |
MEMORY DEVICE TYPE |
FIRST-IN FIRST-OUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND SCHOTTKY AND BIPOLAR AND POSITIVE OUTPUTS AND RESETTABLE |
| ADAU |
BODY HEIGHT |
0.045 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |