| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 DRIVER, POWER |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
800.0 MILLIWATTS |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND HIGH VOLTAGE AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND MONOLITHIC AND MEDIUM SPEED |
| CZEQ |
TIME RATING PER CHACTERISTIC |
65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| SUPP |
SUPPLEMENTARY FEATURES |
30 AUG. 00 ITEM REVIEWED UNDER GIRDER PROJECT; COUNTRY NON-CONCUR CANCELLATION ACTION |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 2 INPUT |