5962-01-105-5070 ( NKBD-621 , 1301521 , ROM/PROM )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-105-5070 5962 011055070 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
ADAU BODY HEIGHT 0.070 INCHES NOMINAL
CQZP INPUT CIRCUIT PATTERN 12 INPUT
ADAT BODY WIDTH 0.500 INCHES NOMINAL
CRHL BIT QUANTITY (NON-CORE) 3600
ADAQ BODY LENGTH 1.970 INCHES NOMINAL
AFGA OPERATING TEMP RANGE -0.0/+70.0 DEG CELSIUS
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
CZER MEMORY DEVICE TYPE ROM
TTQY TERMINAL TYPE AND QUANTITY 40 PRINTED CIRCUIT
CWSG TERMINAL SURFACE TREATMENT SOLDER
CBBL FEATURES PROVIDED MONOLITHIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
NKBD-621 14936 A 1 5 E TX
1301521 55257 F 9 3 5 TX
ROM/PROM 16236 A 1 5 5 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
NKBD-621 14936 GENERAL SEMICONDUCTOR INC A A
1301521 55257 RAMTEK CORP A F
ROM/PROM 16236 DLA LAND AND MARITIME A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 12/25/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DN 9B----- N
DS I
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DN SMS Y 1 EA 0 U 9B----- N
DS SMS Y 1 EA 0 U D
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 35325 J 658 3 5 A H Y ELEC APPLIANCES/INSTRUMENTS NOI