5962-01-107-8493 ( 303BL902X , 303BL902 , 303BL902 )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-107-8493 5962 011078493 MICROCIRCUIT,DIGITAL 3177
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM
CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC
CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND BUFFER
ADAU BODY HEIGHT 0.180 INCHES NOMINAL
ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND EXPANDABLE AND WIRE-OR OUTPUTS
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 15.0 VOLTS MAXIMUM POWER SOURCE
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
303BL902X 15818 F 9 3 5 TX
303BL902 54832 A 1 C AC 5 ZZ
303BL902 15818 F 9 5 5 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
303BL902X 15818 TELCOM SEMICONDUCTOR INC A F
303BL902 54832 AEROFLEX LABORATORIES INC A A
303BL902 15818 TELCOM SEMICONDUCTOR INC A F
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 02/14/1 N 8542900000 3177
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DN 9B----- N X FORMERLY 6625-01-107-8493
DS I X FORMERLY 6625-01-107-8493
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DN SMS Z 1 EA 0 U 9B----- N
DS SMS Z 1 EA 0 U D
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 35325 J 658 Z 5 A H Y ELEC APPLIANCES/INSTRUMENTS NOI