| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| PRMT |
PRECIOUS MATERIAL |
GOLD |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH RELIABILITY |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
16.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, NAND |
| ADAQ |
BODY LENGTH |
0.785 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACE OPTION GOLD |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD OR SOLDER |