| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ABKW |
OVERALL HEIGHT |
0.330 INCHES NOMINAL |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 FLIP-FLOP, D-TYPE |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.180 INCHES NOMINAL |
| CBBL |
FEATURES PROVIDED |
W/CLOCK AND W/CLEAR AND HERMETICALLY SEALED AND POSITIVE EDGE TRIGGERED AND MONOLITHIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
14.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |