| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
BUS REGISTER,SERIAL PARALLEL INPUT,SERIAL/PARALLEL OUTPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
20.0 VOLTS NOMINAL POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| ADAT |
BODY WIDTH |
0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
MO-015-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAU |
BODY HEIGHT |
0.090 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 REGISTER |
| ADAQ |
BODY LENGTH |
1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
EXPANDABLE AND BIDIRECTIONAL AND W/CLOCK AND SYNCHRONOUS AND TRUE/COMPLEMENTARY AND HERMETICALLY SEALED AND ASYNCHRONOUS AND STATIC OPERATION |
| CQZP |
INPUT CIRCUIT PATTERN |
8 STAGE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |