| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
80063-SM-A-858370 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQZP |
INPUT CIRCUIT PATTERN |
9 INPUT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
4 LATCH, NAND, R/S |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-5 MIL-M-38510 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
BURN IN AND W/RESET AND W/ENABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.440 INCHES MAXIMUM |