| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
1.280 INCHES MINIMUM AND 1.320 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.120 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ABKW |
OVERALL HEIGHT |
0.410 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1000.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAT |
BODY WIDTH |
0.770 INCHES MINIMUM AND 0.810 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
18.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 CONVERTER, ANALOG TO DIGITAL |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL |
FEATURES PROVIDED |
HYBRID AND HERMETICALLY SEALED AND W/ENABLE AND BIPOLAR AND W/CLOCK AND BURN IN |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
BIT QUANTITY (NON-CORE) |
8 |