5962-01-157-0464 ( 2614-25F/883B )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-157-0464 5962 011570464 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
ADAU BODY HEIGHT 0.175 INCHES MAXIMUM
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
ADAQ BODY LENGTH 0.925 INCHES MAXIMUM
AFGA OPERATING TEMP RANGE -10.0/+80.0 DEG CELSIUS
ADAT BODY WIDTH 0.302 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -55.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CRHL BIT QUANTITY (NON-CORE) 4096
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
CZER MEMORY DEVICE TYPE RAM
CBBL FEATURES PROVIDED 3-STATE OUTPUT AND HIGH SPEED AND MONOLITHIC
CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC
TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
CSWJ WORD QUANTITY (NON-CORE) 1024
CQZP INPUT CIRCUIT PATTERN 10 INPUT
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
2614-25F/883B 18324 A 2 3 6 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
2614-25F/883B 18324 PHILIPS SEMICONDUCTORS INC A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 06/29/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DS I
DN 9B----- N
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DN SMS J 1 EA 0 U 9B----- N
DS SMS J 1 EA 0 U D
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC