| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
2 INPUT AND 12 STAGE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CZEQ |
TIME RATING PER CHACTERISTIC |
900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-5 MIL-M-38510 |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COUNTER, BINARY |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
W/INDEPENDENT OUTPUTS AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND BUFFERED RESET AND STATIC OPERATION AND LOW POWER AND COMPATIBLE CMOS AND NEGATIVE EDGE TRIGGERED AND W/SHAPING AND W/RIPPLE CARRY AND MEDIUM SPEED AND BURN IN, MIL-STD-883, CLASS C AND BURN IN, MIL-STD-883, CLASS D AND 2-STATE OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| ADAQ |
BODY LENGTH |
0.400 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |