| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
1.290 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-3 MIL-M-38510 |
| CZEQ |
TIME RATING PER CHACTERISTIC |
90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
13 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
3-STATE OUTPUT AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND HIGH IMPEDANCE |
| CRHL |
BIT QUANTITY (NON-CORE) |
4096 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.02 WATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CSWJ |
WORD QUANTITY (NON-CORE) |
512 |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| TEST |
TEST DATA DOCUMENT |
98747-7783177 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS NOMINAL POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |