| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAU |
BODY HEIGHT |
0.165 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.990 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
3-STATE OUTPUT AND STATIC OPERATION AND HERMETICALLY SEALED AND W/ENABLE |
| AFGA |
OPERATING TEMP RANGE |
+0.0/+70.0 DEG CELSIUS |
| AGAV |
END ITEM IDENTIFICATION |
6930LLC006290 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 PRINTED CIRCUIT |
| CQZP |
INPUT CIRCUIT PATTERN |
14 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
370.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CRHL |
BIT QUANTITY (NON-CORE) |
4096 |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CSWJ |
WORD QUANTITY (NON-CORE) |
1024 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAT |
BODY WIDTH |
0.310 INCHES MAXIMUM |