5962-01-202-2950 ( DS26LS32CJ , DS26LS32CN , ES48TTL-26LS32 , 000-8003-250 , AM26LS32CJ , AM26LS32DC )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-01-202-2950 | 5962 | 012022950 | MICROCIRCUIT,DIGITAL | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 57230-ES48TTL-26LS32 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND LOW POWER AND 3-STATE OUTPUT AND SCHOTTKY |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.115 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| AFJQ | STORAGE TEMP RANGE | -65.0/+165.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 RECEIVER, LINE DIFFERENTIAL |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| DS26LS32CJ | 27014 | A | 9 | 5 | E | TX | |
| DS26LS32CN | 27014 | A | 1 | 5 | E | ZZ | |
| ES48TTL-26LS32 | 57230 | F | 9 | 3 | A | TX | |
| 000-8003-250 | 94756 | A | 2 | 5 | 5 | TX | |
| AM26LS32CJ | 01295 | A | 1 | 5 | E | TX | |
| AM26LS32DC | 34335 | A | 1 | 5 | E | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| DS26LS32CJ | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| DS26LS32CN | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| ES48TTL-26LS32 | 57230 | GOULD INC | A | F |
| 000-8003-250 | 94756 | BOEING COMPANY, THE | F | A |
| AM26LS32CJ | 01295 | TEXAS INSTRUMENTS INCORPORATED | A | A |
| AM26LS32DC | 34335 | ADVANCED MICRO DEVICES, INC. | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | Q | 02/28/1 | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 73930 | J | 658 | 3 | 9 | A | H | Z | ELEC APPLIANCES/INSTRUMENTS NOI |