5962-01-238-6195 ( TS68000MCB/B10 , TS68000MCB/C10 , B4040163 , SC87872L , 68000-10/BXCJC )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-238-6195 5962 012386195 MICROCIRCUIT,DIGITAL 3177
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
TTQY TERMINAL TYPE AND QUANTITY 64 PRINTED CIRCUIT
CRHL BIT QUANTITY (NON-CORE) 16
CQSJ INCLOSURE MATERIAL CERAMIC
CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE
AFGA OPERATING TEMP RANGE -55.0/+100.0 DEG CELSIUS
CSSL DESIGN FUNCTION AND QUANTITY 1 MICROPROCESSOR
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
TS68000MCB/B10 57962 A 9 5 E TX
TS68000MCB/C10 57962 A 2 5 6 TX
B4040163 56996 A 2 3 A TX
SC87872L 04713 A 9 5 5 TX
68000-10/BXCJC 04713 A 2 5 E TX
Manufacturers
Part SKU Cage Manufacturer Type Status
TS68000MCB/B10 57962 STMICROELECTRONICS INC A A
TS68000MCB/C10 57962 STMICROELECTRONICS INC A A
B4040163 56996 DEPARTMENT OF THE ARMY HQ A A
SC87872L 04713 FREESCALE SEMICONDUCTOR INC. F A
68000-10/BXCJC 04713 FREESCALE SEMICONDUCTOR INC. F A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 3 08/16/1 B N 8542900000 3177
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DF N SF9AH-N F
DA Z Q2200X- A
DS N I
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DS SMS Z 1 EA 0 U D
DF SMS Z 1 EA 0 U SF9AH-N F
DA SMS Z 1 EA 0 U Z Q2200X- A
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Q 2 2 00 X
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 34580 J 72D Z 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI