| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
5 INPUT AND 16 CHANNEL |
| ADAU |
BODY HEIGHT |
0.089 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MULTIPLEXER, ANALOG |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAQ |
BODY LENGTH |
0.450 INCHES NOMINAL |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAT |
BODY WIDTH |
0.450 INCHES NOMINAL |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CZEQ |
TIME RATING PER CHACTERISTIC |
200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
2000.0 MILLIWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND DIELECTRIC ISOLATED AND HIGH SPEED AND ELECTROSTATIC SENSITIVE AND BURN IN AND MONOLITHIC |