| ADAU |
BODY HEIGHT |
0.175 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CRHL |
BIT QUANTITY (NON-CORE) |
2048 |
| ADAT |
BODY WIDTH |
0.600 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
36 INPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.5 WATTS |
| CBBL |
FEATURES PROVIDED |
PROGRAMMABLE AND HERMETICALLY SEALED AND W/ENABLE AND BIDIRECTIONAL AND STATIC OPERATION |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| CQWX |
OUTPUT LOGIC FORM |
METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAQ |
BODY LENGTH |
2.080 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
40 PRINTED CIRCUIT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSWJ |
WORD QUANTITY (NON-CORE) |
256 |