| CZEQ |
TIME RATING PER CHACTERISTIC |
100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 TIMER, INTERVAL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CBBL |
FEATURES PROVIDED |
HIGH PERFORMANCE AND PROGRAMMABLE AND W/CLOCK |
| CQZP |
INPUT CIRCUIT PATTERN |
19 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAQ |
BODY LENGTH |
1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |