5962-01-262-2720 ( PAL16R6B-2MJ883B , ROM/PROM HEAD 198 , PAL16R6B2J/883 , 5962-8515507RA , 5962-85155 , TIBPAL16R6-30MJB , 5962-8515507RB )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-01-262-2720 | 5962 | 012622720 | MICROCIRCUIT,MEMORY | 4101 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 0.6 WATTS |
| ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CZER | MEMORY DEVICE TYPE | PAL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CQSJ | INCLOSURE MATERIAL | METAL OR PLASTIC OR CERAMIC |
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| PAL16R6B-2MJ883B | 50364 | F | 9 | 5 | E | TX | |
| ROM/PROM HEAD 198 | 16236 | A | 1 | 5 | 9 | ZZ | |
| PAL16R6B2J/883 | 27014 | A | 1 | 5 | E | TX | |
| 5962-8515507RA | 67268 | A | 2 | 2 | E | TX | |
| 5962-85155 | 67268 | A | 1 | 4 | E | TX | |
| TIBPAL16R6-30MJB | 01295 | A | 1 | 5 | E | TX | |
| 5962-8515507RB | 67268 | A | 9 | 5 | E | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| PAL16R6B-2MJ883B | 50364 | MMI/AMD | A | F |
| ROM/PROM HEAD 198 | 16236 | DLA LAND AND MARITIME | A | A |
| PAL16R6B2J/883 | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| 5962-8515507RA | 67268 | DLA LAND AND MARITIME | A | A |
| 5962-85155 | 67268 | DLA LAND AND MARITIME | A | A |
| TIBPAL16R6-30MJB | 01295 | TEXAS INSTRUMENTS INCORPORATED | A | A |
| 5962-8515507RB | 67268 | DLA LAND AND MARITIME | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | Q | 3 | 08/26/1 | D | N | 8542900000 | 4101 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DS | N | I | |||
| DF | N | SF9EH-N | F |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| Q | A | N | 0 | X | D |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DF | SMS | Z | 1 | EA | 0 | U | SF9EH-N | F | |
| DS | SMS | Z | 1 | EA | 0 | U | D |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 73930 | J | 72D | 3 | 9 | A | H | Z | ELEC APPLIANCES/INSTRUMENTS NOI |