| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| ADAU |
BODY HEIGHT |
5.3 MILLIMETERS MAXIMUM |
| AGAV |
END ITEM IDENTIFICATION |
6740-01-058-8710 TITLER,AERIAL R |
| AFGA |
OPERATING TEMP RANGE |
+0.0/+70.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| ADAQ |
BODY LENGTH |
32.0 MILLIMETERS NOMINAL |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| AFJQ |
STORAGE TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CBBL |
FEATURES PROVIDED |
HIGH SPEED AND LOW POWER AND W/ENABLE AND BIDIRECTIONAL |
| CRHL |
BIT QUANTITY (NON-CORE) |
16384 |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CSWJ |
WORD QUANTITY (NON-CORE) |
2048 |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| CQZP |
INPUT CIRCUIT PATTERN |
22 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAT |
BODY WIDTH |
13.4 MILLIMETERS NOMINAL |