5962-01-273-3103 ( C57402J/883B , C57402J/883B )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-273-3103 5962 012733103 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CQZP INPUT CIRCUIT PATTERN 9 INPUT
ADAT BODY WIDTH 0.293 INCHES NOMINAL
ADAQ BODY LENGTH 0.898 INCHES NOMINAL
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
ADAU BODY HEIGHT 0.158 INCHES NOMINAL
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
CBBL FEATURES PROVIDED HIGH SPEED AND ASYNCHRONOUS AND HERMETICALLY SEALED
CZER MEMORY DEVICE TYPE ROM
CZEQ TIME RATING PER CHACTERISTIC 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
C57402J/883B 50364 F 9 3 E TX
C57402J/883B 34335 A 2 5 3 ZZ
Manufacturers
Part SKU Cage Manufacturer Type Status
C57402J/883B 50364 MMI/AMD A F
C57402J/883B 34335 ADVANCED MICRO DEVICES, INC. A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X D 1 02/23/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DM Z 12B2--- M
DS I
DN 9B----- N
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
D A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DS SMS Y 1 EA 0 7 D
DN SMS Y 1 EA 0 7 9B----- N
DM SMS Y 1 EA 0 7 Z 12B2--- M
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 34580 J 72D 3 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI