5962-01-277-6831 ( PALC16R4-40DMB , ROM/PROM )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-277-6831 5962 012776831 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.970 INCHES MAXIMUM
CQZP INPUT CIRCUIT PATTERN 9 INPUT
CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510
TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT
ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM
ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CZER MEMORY DEVICE TYPE PAL
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CBBL FEATURES PROVIDED MONOLITHIC AND ULTRAVIOLET ERASABLE
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
PALC16R4-40DMB 65786 A 9 3 E TX
ROM/PROM 16236 A 1 5 6 TX
Manufacturers
Part SKU Cage Manufacturer Type Status
PALC16R4-40DMB 65786 CYPRESS SEMICONDUCTOR CORPORATIO A A
ROM/PROM 16236 DLA LAND AND MARITIME A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 04/26/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DA Z Q2200X- A V DISCONTINUED W/O REPLACEMENT
DS I
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DS SMS X 1 EA 0 U D
DA SMS V 0 EA 0 U Z Q2200X- A
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Q 2 2 00 X
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 34580 J 72D Z 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI