5962-01-297-0861 ( LM556J/883B , SB00239 , SG556J/883B , SE556J/883B , SE556F883B , RA3047 , 7905427-05 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-01-297-0861 | 5962 | 012970861 | MICROCIRCUIT,LINEAR | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 TIMER |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.0 VOLTS MAXIMUM POWER SOURCE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| LM556J/883B | 27014 | A | 1 | 5 | E | TX | |
| SB00239 | 90536 | A | 1 | 5 | A | TX | |
| SG556J/883B | 34333 | A | 1 | 5 | E | TX | |
| SE556J/883B | 01295 | A | 9 | 5 | E | TX | |
| SE556F883B | 18324 | A | 1 | 5 | E | TX | |
| RA3047 | 07933 | A | 1 | 5 | E | TX | |
| 7905427-05 | 90536 | A | 2 | 3 | A | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| LM556J/883B | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| SB00239 | 90536 | LOCKHEED MARTIN CORPORATION | A | A |
| SG556J/883B | 34333 | MICROSEMI CORP.-INTEGRATED PRODU | A | A |
| SE556J/883B | 01295 | TEXAS INSTRUMENTS INCORPORATED | A | A |
| SE556F883B | 18324 | PHILIPS SEMICONDUCTORS INC | A | A |
| RA3047 | 07933 | FAIRCHILD SEMICONDUCTOR CORP | A | A |
| 7905427-05 | 90536 | LOCKHEED MARTIN CORPORATION | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | Q | 03/29/1 | B | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DS | I | ||||
| DN | 9B----- | N |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| Q | A | N | 0 | X | B |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DN | SMS | J | 1 | EA | 0 | U | 9B----- | N | |
| DS | SMS | J | 1 | EA | 0 | U | D |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 34580 | J | 72D | 3 | 9 | A | H | Z | ELEC APPLIANCES/INSTRUMENTS NOI |