5962-01-298-2293 ( ROM/PROM FAMILY 089 , 1820-3155 , 1820-3155 , PLS100N )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-298-2293 5962 012982293 MICROCIRCUIT,MEMORY 4101
NSN Features
MRC Parameter Characteristics
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT
ADAQ BODY LENGTH 1.520 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CZER MEMORY DEVICE TYPE PAL
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE
CQSJ INCLOSURE MATERIAL CERAMIC
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
CQZP INPUT CIRCUIT PATTERN 18 INPUT
ADAU BODY HEIGHT 0.303 INCHES MAXIMUM
CBBL FEATURES PROVIDED BURN IN AND BIPOLAR AND PROGRAMMED
ADAT BODY WIDTH 0.625 INCHES MAXIMUM
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
ROM/PROM FAMILY 089 16236 A 1 5 6 TX
1820-3155 28480 A 2 3 E TX
1820-3155 50440 H 2 5 E TX
PLS100N 18324 A 1 5 E TX
Manufacturers
Part SKU Cage Manufacturer Type Status
ROM/PROM FAMILY 089 16236 DLA LAND AND MARITIME A A
1820-3155 28480 HEWLETT PACKARD CO A A
1820-3155 50440 AGILENT TECHNOLOGIES INC. A H
PLS100N 18324 PHILIPS SEMICONDUCTORS INC A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 04/13/1 B N 8542900000 4101
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
061700 X 34580 J 72D 3 9 A H Z ELEC APPLIANCES/INSTRUMENTS NOI