| ADAU |
BODY HEIGHT |
0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CSWJ |
WORD QUANTITY (NON-CORE) |
131072 |
| CQZP |
INPUT CIRCUIT PATTERN |
28 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
1.580 INCHES MINIMUM AND 1.620 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION AND W/ENABLE |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| ADAT |
BODY WIDTH |
0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CRHL |
BIT QUANTITY (NON-CORE) |
1048576 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |