| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CRHL |
BIT QUANTITY (NON-CORE) |
32768 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 LEADLESS |
| CQZP |
INPUT CIRCUIT PATTERN |
26 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-12 MIL-M-38510 |
| CZEQ |
TIME RATING PER CHACTERISTIC |
85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CSWJ |
WORD QUANTITY (NON-CORE) |
4096 |
| ADAT |
BODY WIDTH |
0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |