| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
MS-004CB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 BUFFER |
| ADAU |
BODY HEIGHT |
0.064 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
HEX 1 INPUT |
| ADAT |
BODY WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CBBL |
FEATURES PROVIDED |
BURN IN AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND MONOLITHIC AND W/OPEN COLLECTOR |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| AGAV |
END ITEM IDENTIFICATION |
WEAPON CONTROL SYSTEM AN/SWG-3A |
| CZEQ |
TIME RATING PER CHACTERISTIC |
10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |