| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.930 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAU |
BODY HEIGHT |
0.080 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSWJ |
WORD QUANTITY (NON-CORE) |
4096 |
| CRHL |
BIT QUANTITY (NON-CORE) |
16384 |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ABKW |
OVERALL HEIGHT |
0.265 INCHES MINIMUM AND 0.375 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
18 INPUT |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL |
FEATURES PROVIDED |
STATIC OPERATION AND BURN IN AND HERMETICALLY SEALED AND W/ENABLE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
385.0 MILLIWATTS |