| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
1.290 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-3 MIL-M-38510 |
| CRHL |
BIT QUANTITY (NON-CORE) |
32768 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
14 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ABKW |
OVERALL HEIGHT |
0.345 INCHES MINIMUM AND 0.425 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSWJ |
WORD QUANTITY (NON-CORE) |
4096 |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZEQ |
TIME RATING PER CHACTERISTIC |
200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |