| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 PRINTED CIRCUIT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
6.5 VOLTS MAXIMUM POWER SOURCE |
| CSWJ |
WORD QUANTITY (NON-CORE) |
32768 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| ADAU |
BODY HEIGHT |
0.217 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
PROGRAMMED AND MONOLITHIC AND BURN IN AND ULTRAVIOLET ERASABLE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-10 MIL-M-38510 |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAQ |
BODY LENGTH |
1.490 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQZP |
INPUT CIRCUIT PATTERN |
18 INPUT |
| CRHL |
BIT QUANTITY (NON-CORE) |
262144 |
| ADAT |
BODY WIDTH |
0.610 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| ABMK |
OVERALL WIDTH |
0.620 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ABHP |
OVERALL LENGTH |
1.490 INCHES MAXIMUM |
| ABKW |
OVERALL HEIGHT |
0.432 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |