| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
9 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
100.0 MILLIWATTS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ |
BODY LENGTH |
0.390 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
W/CLEAR AND NEGATIVE EDGE TRIGGERED AND BURN IN AND HERMETICALLY SEALED AND W/PRESET |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 FLIP-FLOP, J-K, AND INPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-2 MIL-M-38510 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |