| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| ADAQ |
BODY LENGTH |
2.096 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.620 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.2 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
37 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CBBL |
FEATURES PROVIDED |
ERASABLE AND BIDIRECTIONAL AND PROGRAMMABLE AND BURN IN AND HERMETICALLY SEALED AND W/CLOCK |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
380.0 MILLIWATTS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 ARRAY, LOGIC |
| ADAU |
BODY HEIGHT |
0.210 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
40 PRINTED CIRCUIT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |