| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ABHP |
OVERALL LENGTH |
1.440 INCHES MINIMUM AND 1.465 INCHES MAXIMUM |
| ABMK |
OVERALL WIDTH |
1.440 INCHES MINIMUM AND 1.465 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.115 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 PROCESSOR, INPUT/OUTPUT |
| CBBL |
FEATURES PROVIDED |
W/CLOCK AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HIGH IMPEDANCE AND W/STROBE |
| ADAT |
BODY WIDTH |
0.940 INCHES MINIMUM AND 0.965 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ |
BODY LENGTH |
0.940 INCHES MINIMUM AND 0.965 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
21 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
68 FLAT LEADS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |