| CTQX |
CURRENT RATING PER CHARACTERISTIC |
45.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSWJ |
WORD QUANTITY (NON-CORE) |
64 |
| CQZP |
INPUT CIRCUIT PATTERN |
7 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
175.0 MILLIWATTS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
35.00 NANOSECONDS MAXIMUM ACCESS |
| CZER |
MEMORY DEVICE TYPE |
FIRST-IN FIRST-OUT |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
5.00 INPUT PASCAL DENSE STRUCTURAL 65 AND 7.00 OUTPUT PASCAL DENSE STRUCTURAL 65 |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
| CRHL |
BIT QUANTITY (NON-CORE) |
256 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CBBL |
FEATURES PROVIDED |
LOW POWER AND HERMETICALLY SEALED AND BURN IN AND PARALLEL OPERATION |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| PKWT |
UNPACKAGED UNIT WEIGHT |
2.2 GRAMS |
| ABKW |
OVERALL HEIGHT |
0.375 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.185 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |