| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| PRMT |
PRECIOUS MATERIAL |
GOLD |
| ABHP |
OVERALL LENGTH |
1.640 INCHES MINIMUM AND 1.870 INCHES MAXIMUM |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT,PROGRAMMED(EWEGO DISK-8) |
| ADAU |
BODY HEIGHT |
0.090 INCHES MINIMUM AND 0.145 INCHES MAXIMUM |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
300.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ABMK |
OVERALL WIDTH |
1.640 INCHES MINIMUM AND 1.870 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
90.00 NANOSECONDS MAXIMUM ACCESS |
| CZER |
MEMORY DEVICE TYPE |
PROGRAMMED |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.5 WATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
BEAM CHIP |
| TTQY |
TERMINAL TYPE AND QUANTITY |
68 BEAM LEAD |
| CBBL |
FEATURES PROVIDED |
BIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MEDIUM VOLTAGE AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
| ADAT |
BODY WIDTH |
0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQZP |
INPUT CIRCUIT PATTERN |
64 INPUT |