| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-M-38510 SPECIFICATION |
| ABHP |
OVERALL LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ABMK |
OVERALL WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ZZZK |
SPECIFICATION/STANDARD DATA |
81349-MIL-M-38510/301 GOVERNMENT SPECIFICATION |
| ADAT |
BODY WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-2 MIL-M-38510 |
| ABKW |
OVERALL HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
18.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
4 FLIP-FLOP, D-TYPE |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CQZP |
INPUT CIRCUIT PATTERN |
6 INPUT |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
LOW POWER AND HERMETICALLY SEALED AND W/COMMON CLOCK AND BIPOLAR AND MONOLITHIC AND W/COMMON CLEAR AND CASCADABLE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 51.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
25.0 MILLIWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |