| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-M-38510 SPECIFICATION |
| ADAU |
BODY HEIGHT |
0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-8 MIL-M-38510 |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
ERR-060 MAXIMUM AND ERR-060 MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 PRINTED CIRCUIT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
8 FLIP-FLOP, D-TYPE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
50.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| ZZZK |
SPECIFICATION/STANDARD DATA |
81349-MIL-M-38510/654 GOVERNMENT SPECIFICATION |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
300.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
41.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 41.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAQ |
BODY LENGTH |
1.060 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| PKWT |
UNPACKAGED UNIT WEIGHT |
2.4 GRAMS |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| ABKW |
OVERALL HEIGHT |
0.400 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| ABHP |
OVERALL LENGTH |
1.060 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |