| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
BURN IN AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND HERMETICALLY SEALED AND ERASABLE |
| CZER |
MEMORY DEVICE TYPE |
EPROM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 PRINTED CIRCUIT |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.6 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| AFJQ |
STORAGE TEMP RANGE |
-60.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-10 MIL-M-38510 |
| CSWJ |
WORD QUANTITY (NON-CORE) |
8192 |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
500.00 MICROAMPERES MAXIMUM SUPPLY |
| ADAU |
BODY HEIGHT |
0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CQZP |
INPUT CIRCUIT PATTERN |
16 INPUT |
| ADAQ |
BODY LENGTH |
1.490 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CRHL |
BIT QUANTITY (NON-CORE) |
65536 |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZEQ |
TIME RATING PER CHACTERISTIC |
70.00 NANOSECONDS MAXIMUM DELAY |
| ABHP |
OVERALL LENGTH |
1.490 INCHES MAXIMUM |
| ABKW |
OVERALL HEIGHT |
0.432 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |