| ABMK |
OVERALL WIDTH |
0.975 INCHES MINIMUM AND 1.000 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
68 J-HOOK |
| CQZP |
INPUT CIRCUIT PATTERN |
32 INPUT AND 32 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ABKW |
OVERALL HEIGHT |
0.085 INCHES MINIMUM AND 0.190 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
PAL |
| ADAU |
BODY HEIGHT |
0.075 INCHES MINIMUM AND 0.155 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-65.0/+135.0 DEG CELSIUS |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MACROCELL LOGIC ARRAY |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADED CHIP CARRIER |
| ADAT |
BODY WIDTH |
0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
PROGRAMMABLE AND ERASABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883 AND BIDIRECTIONAL |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.5 WATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM |
| ABHP |
OVERALL LENGTH |
0.975 INCHES MINIMUM AND 1.000 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |