5962-01-355-9329 ( 1820-5416 , HD68HC0008Y , MC68HC000R8 , 1820-5416 )

NSN Information
NSN FSC NIIN Item Name INC
5962-01-355-9329 5962 013559329 MICROCIRCUIT,DIGITAL 3177
NSN Features
MRC Parameter Characteristics
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CBBL FEATURES PROVIDED BURN IN
TTQY TERMINAL TYPE AND QUANTITY 10 PIN
ADAT BODY WIDTH 1.062 INCHES MAXIMUM
ADAQ BODY LENGTH 1.062 INCHES MAXIMUM
ADAU BODY HEIGHT 0.062 INCHES MAXIMUM
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQSZ INCLOSURE CONFIGURATION CAN
CSSL DESIGN FUNCTION AND QUANTITY 1 MICROPROCESSOR
CWSG TERMINAL SURFACE TREATMENT SOLDER
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
1820-5416 28480 A 9 5 A TX
HD68HC0008Y 62786 A 2 5 E ZZ
MC68HC000R8 04713 A 2 5 E ZZ
1820-5416 1LQK8 A 2 3 5 ZZ
Manufacturers
Part SKU Cage Manufacturer Type Status
1820-5416 28480 HEWLETT PACKARD CO A A
HD68HC0008Y 62786 HITACHI AMERICA, LTD. F A
MC68HC000R8 04713 FREESCALE SEMICONDUCTOR INC. F A
1820-5416 1LQK8 AGILENT TECHNOLOGIES INC. A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X Q 03/26/1 B N 8542900000 3177
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DS I
DN 9B----- N
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Q A N 0 X B
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DS SMS Z 1 EA 0 U D
DN SMS Z 1 EA 0 U 9B----- N
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
060500 X 81820 Z 72D Z 9 A H Z ELECTRICAL EQUIPMENT GROUP