| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ABHP |
OVERALL LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
130.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| ABMK |
OVERALL WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
AND-OR ARRAY |
| ADAT |
BODY WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-2 MIL-M-38510 |
| ABKW |
OVERALL HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
PAL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.5 WATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
18 INPUT |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE AND MONOLITHIC AND BIDIRECTIONAL AND PROGRAMMABLE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |