| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1509.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND HIGH IMPEDANCE |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
150.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 3 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 DRIVER, LINE |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.840 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-2 MIL-M-38510 |
| CZEQ |
TIME RATING PER CHACTERISTIC |
375.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 375.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |