| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
11.50 NANOSECONDS MAXIMUM DELAY |
| ADAQ |
BODY LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
8 FLIP-FLOP, D-TYPE |
| CBBL |
FEATURES PROVIDED |
3-STATE OUTPUT AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
475.0 MILLIWATTS |
| ADAT |
BODY WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-2 MIL-M-38510 |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
86.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |